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- Thermal Control Unit
- Thermal Simulation
- Thermoelectronic Cooler Controller
- iSocket
- Passive Heat Sink
THERMAL SOLUTIONS
As the semiconductor market has progressed, control of device power dissipation, and resulting device temperatures, has been the root cause in lower production burn-in yields and device throughput. With the advent of finer IC architecture, demand for higher power devices, and more complex ICs, power dissipation variations can vary 10W or more from devices made on the same wafer. Burn-in engineers need more intelligent, and lower cost, methods of monitoring and controlling device temperatures in order to maintain maximum yield and throughput. Let WELLS-CTI provide a solution for you!